Using standardized tests like IPC, ASTM, ISO, and other methods, thermal analysis tests a large number of materials used in the electronics industry, such as silicon wafers, printed circuit boards, photo-resists, and packing, to name a few. In addition, thermal analysis also tests the packaging material in which electronic products are shipped (see polymers).
Common tests include:
- Glass transitions by DSC, TMA or DMA
- Curing studies
- Photo-resists and photo-cured adhesives studies
- Modulus and damping properties by DMA
- Thermal Expansion in X, Y, or Z axis (size stability) by TMA
- Delamination by TMA
- Solvent exposure testing in DMA
- Quality control on plastic coverings and coatings
- Confirmation of Polymer type and grade by FTIR and DSC
- Melting point on solders, alloys, and other materials
- Curie point transitions in metals
- Outgassing and thermal stability
- Filler content